Encapsulation materials of expoy series for use in electronic components 電子元器件用環(huán)氧系灌封材料
Encapsulation materials of phenolic series for use in electronic components 電子元件用酚醛系包封材料
Encapsulation materials of expoy series powder for use in electronic components 電子元器件用環(huán)氧系粉末包封材料
Biocompatible encapsulation materials and stimulation interfaces , however , need further refinement before a high - fidelity prosthesis becomes a reality , maybe by 2010 然而,要制造出高真實度的人工視網(wǎng)膜,生物相容性包埋物質(zhì)以及刺激界面都還需要進(jìn)一步改良,或許到2010年就能達(dá)到這個目標(biāo)。